EMI Electrically Conductive Form-In-Place Material Gaskets | Parker Chomerics

Electrically-Conductive-Form-in-Place-Material-Gaskets_ct

Parker Chomerics' EMI shielding products are some of the best in the industry. Engineered products and solutions include an extensive selection of EMI die cut and vulcanized gaskets, shielded windows, air ventilation panels, cable shielding, grounding solutions, shielding laminates, tapes, conductive coatings, adhesives, sealants, grease and inks, conductive injection molded plastics material, and board level shielding coatings.

Quotes & Questions
CHOFORM_19-26-5575-0500_137p

CHOFORM 5575 AG/AI Moisture Cure one Component Form-In-Place Silicone EMI Gasketing

19-26-5513-0850_GROUP_160p_FIN

CHOFORM 5513 Ag/Cu Thermal Cure Two Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5526 Ag Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5528 Ag/Cu Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5538 Ni/C Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5550 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

CHOFORM 5560 Ni/AI Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

CHOFORM_19-26-5575-0500_137p

ParPHorm 1800 Form-In-Place Sealing Compound

CHOFORM_19-26-5575-0500_137p

ParPHorm L1938 Form-In-Place Sealing Compound

CHOFORM_19-26-5575-0500_137p

ParpPHorm S1945 Form-In-Place Sealing Compound


Parker Chomerics EMI Shielding Catalogs & Literature

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