THERM-A-GAP 1641 | Parker Chomerics

therm-a-form-1641

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conducti

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

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Technical Specifications

COLOR: White
POLYMER MATERIAL OPTIONS: Silicone
FILLER MATERIAL: Aluminum Oxide
PRODUCT TYPE: 1-part
SPECIFIC GRAVITY: 2.1
DUROMETER: 56 (Shore A)
DYNAMIC VISCOSITY: 3000 poise
OPERATIONAL LIFE: 30 minute pot life
MAXIMUM CURE TIME (AT ROOM TEMPERATURE): 48 hrs @ 23 °C @ 50% RH
THERMAL CONDUCTIVITY: 0.9 W/m-K
HEAT CAPACITY: 1 J/g-K
COEFFICIENT OF THERMAL EXPANSION: 150 ppm/K
OPERATING TEMPERATURE: -94 to 392 °F (-70 to 200 °C)
DIELECTRIC STRENGTH: 20 kVac/mm (500 Vac/mil)
VOLUME RESISTIVITY: 1.0 x 10^13 ohm-cm
DIELECTRIC CONSTANT: 3.9 @ 1000 kHz
DISSIPATION FACTOR: 0.010 @ 1000 kHz
FLAMMABILITY RATING: Not Tested
OUTGASSING TOTAL MASS LOSS: Not Tested
SHELF LIFE: 6 Months
WEIGHT: 70 , 340 g

Features & Benefits

  • Dispensable form-in-place gap filling, potting, sealing, and encapsulating
  • Excellent blend of high thermal conductivity, flexibility, and ease of use
  • Conformable to irregular shapes without excessive force on components
  • Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
  • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
  • Vibration damping

Product Attributes:

  • One-component moisture cure-cure RTV
  • Supplied with primer 1086 (not required for curing but promotes adhesion)
  • Non-acetic acid generating
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