THERM-A-GAP T642 | Parker Chomerics
Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.
THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.
Technical Specifications
COLOR: Blue
POLYMER MATERIAL OPTIONS: Silicone
FILLER MATERIAL: Boron Nitride
PRODUCT TYPE: 2-part
SPECIFIC GRAVITY: 1.5
DUROMETER: 70 (Shore A)
DYNAMIC VISCOSITY: 2500 poise
OPERATIONAL LIFE: 60 minute pot life
MAXIMUM CURE TIME (AT ROOM TEMPERATURE): 3 min @ 150°C or 30 min @ 70°C or 48 hrs @ 23°C
THERMAL CONDUCTIVITY: 1.2 W/m-K
HEAT CAPACITY: 1 J/g-K
COEFFICIENT OF THERMAL EXPANSION: 300 ppm/K
OPERATING TEMPERATURE: -58 to 302 °F (-50 to 150 °C)
DIELECTRIC STRENGTH: 200 kVac/mm (500 Vac/mil)
VOLUME RESISTIVITY: 1.0 x 10^13 ohm-cm
DIELECTRIC CONSTANT: 4 @ 1000 kHz
DISSIPATION FACTOR: 0.001 @ 1000 kHz
FLAMMABILITY RATING: Not Tested
OUTGASSING TOTAL MASS LOSS: 0.32% (0.21% CVCM)
SHELF LIFE: 3 Months
WEIGHT: 53 , 372 g
RATIO: Mix ratio 10:1 (by weight)
Features & Benefits
- Dispensable form-in-place gap filling, potting, sealing, and encapsulating
- Excellent blend of high thermal conductivity, flexibility, and ease of use
- Conformable to irregular shapes without excessive force on components
- Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
- Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
- Vibration damping
Product Attributes:
- High thermal performance with flexibility
- Ideal for underfilling
- Low outgassing
- Boron Nitride filled material
