Thermally Conductive Gap Filler Pads | Parker Chomerics

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Parker Chomerics' wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs including gels, pads, phase change materials, non-silicone solutions and other technologies.

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CHO-THERM Thermally Conductive Electrical Insulator Pads

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CHO-BOND 1087 Silicone Adhesive Primer


Parker Chomerics EMI Shielding Catalogs & Literature

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