Thermally Conductive Gap Filler Pads | Parker Chomerics


Parker Chomerics' wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs including gels, pads, phase change materials, non-silicone solutions and other technologies.

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CHO-THERM Thermally Conductive Electrical Insulator Pads


CHO-BOND 1087 Silicone Adhesive Primer

Parker Chomerics EMI Shielding Catalogs & Literature

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