Thermally Conductive Gap Filler Pads | Parker Chomerics

Parker Chomerics' wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs including gels, pads, phase change materials, non-silicone solutions and other technologies.

All manufacturers are experiencing supply chain delays, and thermal interface materials are no exception. If your current brand is experiencing long delays, give Parker Chomerics a try. Use this Cross Reference to find Chomerics alternative to your current brand.