GAP PAD TGP Thermal Alternative Cross-Reference


THERM-A-GAP gap filler pads are thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat-dissipating surface. With today’s supply chain challenges, it is not always easy to procure the adhesives from your current suppliers. Parker THERM-A-GAP gap filler pads are available with 4-6 week delivery. Find an alternative to GAP PAD TGP below:

Cross-Reference GAP PAD TGP to Parker THERM-A-GAP

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