Parker Chomerics' wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs including gels, pads, phase change materials, non-silicone solutions and other technologies.
THERM-A-GAP GEL 25NS High Performance Non-Silicone Dispensable Gel
THERM-A-GAP GEL 30 High Performance Fully Cured Dispensable Gel
THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable Gel
THERM-A-GAP GEL 37 High Performance Fully Cured Dispensable Gel
THERM-A-GAP GEL 45 High Performance Fully Cured Dispensable Gel
THERM-A-GAP GEL TC50 High Performance Thermal Putty
THERM-A-GAP GEL 8010 High Performance Fully Cured Dispensable Gel
THERM-A-GAP Gels T630 Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gel 75 High Performance Fully Cured Dispensable Gel
