310-A / 310-B | LORD Epoxy Adhesive
LORD® 310 adhesive is a modified, thixotropic, two-component epoxy adhesive system used to bond many types of prepared metals, prepared rubber, urethane and plastics. Originally formulated for primerless adhesion to SMC, LORD 310 adhesive is used to bond disk drives, down-hole oil field equipment, automotive body panels and spoilers, and vibration damping mounts. LORD 310 adhesive can be either room temperature cured or heat cured for faster processing.
Shelf life is two years from date of manufacture when stored at 60-80°F (16-27°C) in original, unopened container.
Adhesive Properties
Data is typical and not to be used for specification purposes
Work Time, min @ 75°F (24°C) 54g mass: 30 - 60
Time to Handling Strength: 6 - 8
Cure Time hr: 24
Mixed Appearance: Grey Paste
Mixed Solids Content by Weight, %: 100
LORD 310-A Resin - Adhesive Properties
Data is typical and not to be used for specification purposes
Appearance: Off-white Paste
Viscosity cP @ 77°F (25°C)Brookfield HBF Helipath, T-C Spindle, 5rpm: 400, 000-820, 000
Density lb/gal (kg/m3): 11.7 - 12.85 (1402 - 1540)
Flash Point, °F (°C) Closed Cup: >200 (>93)
LORD 310-B Hardener - Adhesive Properties
Data is typical and not to be used for specification purposes
Appearance: Off-white Paste
Viscosity cP @ 77°F (25°C) Brookfield HBF Helipath, T-C Spindle, 5rpm: 230,000 - 690,000
Density lb/gal (kg/m3): 10.0 - 11.0 (1198 - 1318)
Flash Point, °F (°C) Closed Cup: >200 (>93)
Features & Benefits
- Durable: provides load bearing properties equal to or greater than the materials being bonded
- Environmentally Recommended: contains no solvent, nonflammable and virtually ordorless
- Environmentally Resistant: resists moisture, sunlight, salt spray and thermal cycling
- Temperature Resistant: performs at temperatures from -40°F to +400°F (-40°C to +204°C); resists postbakes up to 400°F (204°C); resists outgassing up to 225°F (107°C).
- Chemically Resistant: resists dilute acids, alkalis, solvents, oils and hydrocarbons; anti-corrosion processes including phosphatizing and ELPO (e-coat) coatings do not affect adhesive or its bond strength.