Thermally Conductive Cure-In-Place Potting & Underfill Materials | Parker Chomerics

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Parker Chomerics' wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs including gels, pads, phase change materials, non-silicone solutions and other technologies.

All manufacturers are experiencing supply chain delays, and thermal interface materials are no exception. If your current brand is experiencing long delays, give Parker Chomerics a try. Use the Cross Reference below to find Chomerics alternative to your current brand.

Cross Reference

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