SIL PAD TSP Thermal Dielectric Alternative Cross-To
As a recommended replacement for SIL PAD thermal materials, CHO-THERM® Thermal Insulator Pads are designed for use as alternatives to greased mica insulators between discrete power devices and heat sinks. These alternatives to SIL PAD products are offered as dry pads, or with an optional acrylic adhesive (PSA) layer for attachment.
All manufacturers are experiencing supply chain delays, and thermal interface materials are no exception. If your current brand is experiencing long delays, give Parker Chomerics a try. Use the Cross Reference below to find Chomerics alternative to your current brand.
Cross-Reference GAP FILLER TGF to Parker THERM-A-FORM
- Replace SIL PAD TSP 1100ST with CHO-THERM T441-13
- Replace SIL PAD TSP 1800 with CHO-THERM T500 or CHO-THERM 1671
- Replace SIL PAD TSP 1800ST with CHO-THERM T500
- Replace SIL PAD TSP A2000 with CHO-THERM 1678
- Replace SIL PAD TSP A3000 with CHO-THERM 1671
