THERM-A-GAP HCS10 | Parker Chomerics
Parker Chomerics THERM-A-GAP™ HCS10 Thermally Conductive Gap Filler Pads provide an ultra low hardness (4 Shore 00) solution with 1.0 W/m-K of thermal conductivity. THERM-A-GAP™ gap-filler sheets and pads offer excellent thermal properties and the highest conformability at low clamping forces. THERM-A-GAP™ HCS10 is an economical solution and is the highest conformability gap filler sheet.
THERM-A-GAP HCS10 is available in various thicknesses and finished in standard sheets of 9"x9" or 18"x18". Custom size configurations and die cut parts are available as individual parts or on sheets. To receive a quote on a custom size part, choose your thickness and carrier options, and then select “custom” size.
Technical Specifications
SHAPE: Flat Sheets
COLOR: Orange
SPECIFIC GRAVITY: 2
DUROMETER: 4 (Shore 00) Softest
DEFLECTION AT PRESSURE: 73% @ 50 psi (345 kPa)
THERMAL CONDUCTIVITY: 1 W/m-K
THERMAL IMPEDANCE: 1.5 °C-in2 /W (9.7 °C-cm2 /W) °C-cm2/W / 1.5 °C-inch2/W / 9.7 °C-cm2/W
HEAT CAPACITY: 1 J/g-K
COEFFICIENT OF THERMAL EXPANSION: N/A
DIELECTRIC STRENGTH: 200 Vac/mil (8 kVac/mm) VAC/mil
VOLUME RESISTIVITY: 10^14 Ω-cm
OPERATING TEMPERATURE: -67 to 392 (-55 °C to 200 °C) °F
DIELECTRIC CONSTANT: 5.3 @ 1 MHz
DISSIPATION FACTOR: 0.013 @ 1 MHz
OUTGASSING TOTAL MASS LOSS: 0.44 % TML (0.13 % CVCM) %
SHELF LIFE: 18 months "A" carrier, 36 months all others Months
FLAMMABILITY RATING: UL94 V-0
SPECIFICATIONS MET: RoHS, REACH
PRODUCT TYPE: Thermal Gap Pad
Typical Applications:
- Telecommunications equipment
- Consumer electronics
- Automotive electronics (ECUs)
- LEDs & lighting
- Power conversion
- Desktop computers, laptops, servers
- Handheld devices
- Memory modules
- Vibration dampening
Features & Benefits
- Ultra low deflection force requirements
- High thermal conductivity
- High tack surface reduces contact resistance
- UL 94 V-0 flammability rated
- RoHS compliant
Available Carriers
- G – woven glass (no PSA) - this carrier option provides reinforcement and a clean break / low tack interface surface, allowing for re-use of the pad if necessary or for prototyping.
- A – aluminum foil (with PSA) - this carrier’s primary function is to allow a pressure sensitive adhesive on the gap pad.
