Parker Chomerics THERM-A-GAP™ PAD 30 is a thermally conductive gap filler pad with 3.2 W/m-K thermal conductivity.
THERM-A-GAP PAD 30 offers the compelling combination of both excellent thermal performance and conformablility, along with the lowest outgassing to provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures.
THERM-A-GAP PAD 30 has been specifically formulated to conform to surface irregularities and adhere to a wide range of component shapes and sizes.
Product Features
3.2 W/m-K thermal conductivity
Ultra low deflection force
High thermal conductivity
“A” version offers high strength acrylic PSA for permanent attachment
